DRAM封装及模块技术趋势

The Trend of DRAM Packaging and Module Technology

封装形式对内存芯片的速度、容量、电气性能、散热效能、抗干扰、品质等产生明显影响本文评价了DRAM的产品类型、市场状况、封装趋势、内存模块动态。

Packaging style can effect the speed capacity, electronic performance, scatter efficiency, anti-jamming, and quality of the DRAM chip.The DRAM production types market status packaging trend, DRAM module developments and the packaging technology＇s development foreground are described in this paper.