摘要
利用X射线衍射研究了在塑料表面真空生成的铝膜残余应力。结果表明,残余应力在研究范围内为压应力,初步认识了铝薄膜的附着机理。
The residual stress of aluminum film on plastics film substrate is studied with X ray diffraction. The results show that residual stress in the studied bound is compressive, and origins of the residual stress are primarily discussed.
出处
《包装工程》
CAS
CSCD
北大核心
2005年第5期85-87,共3页
Packaging Engineering
关键词
真空镀铝
薄膜
结合界面
残余应力
vacuum - plating Aluminum
thin film
bonded interface
residual stress