多芯片组件技术应用实例

Application of Multi-chip Module Technique

给出了一个基于硅基板的6芯片MCM设计实例。设计中对散热、耐压及抗干扰等进行了优化,使用Zeni EDA工具进行MCM布局、硅基板的版图设计。该MCM经上海市集成电路设计研究中心测试,温升小于10℃、耐压达到70 V。

An example of 6 dies MCM on Si substrate was given, The heat dissipation and withstand voltage and antijamming was optimized in design process. The packaging arrangement and Si substrate layout was designed with Zeni EDA tools.The MCM was tested by Shanghai Integrated Circuit Design and Research Center. The test result indicates that temperature rise is less than 10℃ and withstand voltage is more than 70 V.