摘要
给出了一个基于硅基板的6芯片MCM设计实例。设计中对散热、耐压及抗干扰等进行了优化,使用Zeni EDA工具进行MCM布局、硅基板的版图设计。该MCM经上海市集成电路设计研究中心测试,温升小于10℃、耐压达到70 V。
An example of 6 dies MCM on Si substrate was given, The heat dissipation and withstand voltage and antijamming was optimized in design process. The packaging arrangement and Si substrate layout was designed with Zeni EDA tools.The MCM was tested by Shanghai Integrated Circuit Design and Research Center. The test result indicates that temperature rise is less than 10℃ and withstand voltage is more than 70 V.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2005年第11期42-44,共3页
Electronic Components And Materials
基金
上海市科委SDC专项计划资助项目(037062026)
江苏省高技术研究(工业部分)计划资助项目(BG2005022)
关键词
电子技术
MCM设计
MCM应用实例
硅基板
封装技术
electronic technology
MCM design
MCM application example
Si substrate
packaging technology