多芯片组件热阻技术研究

Thermal Characterization of Multiple Module Using Superposition and FEM

在传统单芯片封装热阻定义的基础上,针对多芯片组件(MCM)传统热阻表示方法的不足,基于线性叠加原理,采用有限元模拟技术,提出了MCM的结到壳的热阻表示方法——热阻矩阵,并利用有限元模拟方法对热阻矩阵进行了验证。结果表明,采用热阻矩阵方法预测器件结温的误差小于2%。

Traditionally the steady thermal performance of packaged semiconductor device has been characterized with a single junction-to-case thermal resistor. This is inadequate for MCM where several power dissipating within the circuit. A new method-thermal resistor matrix is developed to characterize and predict the junction thermal of the MCM using the finite element method and linear superposition method. The result of the thermal resistor matrix is verified with the FEM. The result show that the max error% of the thermal resistor matrix is below 2%.