改进晶片键合质量可靠性的综合分析方法

Hybrid Approach for Improving the Reliability of Die Bonding Process

对提高半导体工业键合工艺可靠性进行实例研究。首先进行键合工艺技术分析,采用了一种定 性方法来辨识故障。实验证实,改进的键合工艺可以降低关键事件对晶片偏转的影响。综合了控制与可靠 性工程方面的知识,提出了一种混合的分析方法。

A case is studied on the reliability improvement of die bonding machine in the semiconductor industry. Firstly, the process was analyzed technically, a qualitative approach was used to identify critical events （root causes）. Experiments were conducted to modify the bonding process to reduce the effects of the critical events. This study combined the knowledge of controlling and reliability engineering and presented a hybrid analytical approach.