利用非光敏BCB树脂实现多芯片组件平坦化研究

MCM Planarized by Non-photosensitive BCB Polymers

多层布线和绝缘介质材料的引入使得多芯片组件的芯片表面形貌凸凹不平,采用旋涂介质膜实现芯片表面平坦是常用的平坦化方法。分别介绍了聚酰亚胺、旋涂玻璃膜和苯并环丁烯(BCB)的平坦化特性,论述了非光敏BCB树脂的平坦化工艺原理。在此原理的基础上实现了非致冷红外焦平面的读出电路芯片平坦化,表面台阶从1.39μm下降到0.097μm,平坦度达到93%。

Multilevel interconnection and the use of dielectric materials make the multichip module （MCM） surface to be very unsmooth. Spining some certain materials on the substrate is a common planarization approach. The planarization characteristics of ployimide, spin on glass and benzocyclobutene （BCB） are presented, and the process theory of planarization using nonphotosensitive benzocyclobutene is described. A CMOS readout IC chip for uncooled IR focal plane array is practically planarized by using this method. The results indicate that the surface step is decreased from 1.39 μm to 0.097 μm and the flatness reaches 93%.