微构件材料力学性能测试方法

Mechanical Testing Methods of Micro Structures

随着MEMS的商业化进程,微构件材料力学性能的研究成为越来越重要的一个课题。微小试件的制备、安装、夹持、微驱动、高分辨率的载荷和位移测量等技术问题都是对微构件材料力学性能测试的很大挑战,很多传统的测试方法和装置已经不再适用了。近十几年,国内外学者发展了一些微构件材料力学性能的研究方法,来测量微构件的弹性模量、屈服强度、断裂强度、残余应力和疲劳强度等。本文从实验系统的集成度出发,将这些测试方法大致分为片外测试和片上测试两类。本文对单轴拉伸法、纳米压痕法、鼓膜法、微梁弯曲法和衬底曲率法等典型的片外测试方法和一些典型的片上测试方法进行了介绍,并比较了各自的优缺点。

With the commercialization of MEMS, the study of mechanical properties of micro structures becomes more and more important. The principal difficulties associated with mechanical testing of micro structures are connected to the fabrication, handling and mounting of micro samples, micro actuation, and the measurement of load and displacement with high resolution etc. A large number of traditional testing methods and equipments are not applicable to the microscale mechanical testing. In recent years, a number of mechanical testing methods are developed for measuring the properties of micro structures, such as the Young＇s modulus, yield strength, fracture strength, residual stress, and fatigue strength. Based on whether the testing samples, sensors and actuators are integrated into the testingsystems, these methods are approximately divided into two groups, out-chip and on-chip exPerimental techniques. Several representative out-chip testing methods, such as microtensile testing, nanoindentation, bulge test, microbeam bending test, and wafer curvature measurement, and several of the important on-chip testing methods are reviewed. Their advantages and disadvantages are discussed.