摘要
钛及钛合金与非金属材料的扩散连接技术是当前材料连接领域的热点之一。综述了钛合金与陶瓷、石 墨和半导体非金属材料扩散连接研究现状与发展,重点介绍了界面反应、连接工艺研究等内容,分析其优势与局限 性,并展望其发展趋势。
The diffusion bonding technique of titanium or titanium alloy and nonmetals is one of the central issues in materials bonding field now. The research status and development of diffusion bonding titanium or titanium alloy and nonmetals （graphite and semiconductor） was reviewed in this paper, which placed emphasis on the interface reaction and bonding technology as well as the advantage, limitation, and the trend of its development was analyzed.
出处
《焊接》
北大核心
2005年第10期9-12,共4页
Welding & Joining
基金
国家自然科学基金资助项目(No.50375065)
现代焊接生产技术国家重点试验室资助项目
