新型的化学镀锡在无铅焊接之运用

New Electroless Tin Process for Lead-free Soldering

阐述线路板的绿色表面涂覆的化学镀锡工艺的有关理论和技术,化学镀锡应用是实现取代热风整平表面涂覆绿色化的最重要的手段之一。我司第三代化学镀锡应用是突破目前化学沉锡的供应商共拥硫脲作为电位改变剂配方此环节,是一种新型独特的科技。

This paper describes the theoretics and technology of electroless tin at surface coating of environment protected, electroless tin using is the one of the best important way for replace hot air solder leveling process in surface coating of environment protected. The third generation of electroless tin solution in our company break through present other suppliers use thiourea as voltage drop agent, it is a new style technology.