摘要
根据无铅回流焊的工艺特点,论述了对回流炉加热、冷却、助焊剂管理和氮气保护各系统的改造原则和方案,给出了氮气保护系统的评价标准,对罐装氮气和氮气发生器两种供应系统进行了成本估算和对比。
This article presents the principle and access of the restructure of reflow oven according to the specialty of lead-free soldering techniques, including heating, cooling,flux management and nitrogen protection. We also present a evaluation system of nitrogen protection and then make a cost comparison of two different N2 production systems .
出处
《电子工业专用设备》
2005年第10期42-47,共6页
Equipment for Electronic Products Manufacturing
关键词
无铅回流炉
加热系统
冷却系统
助焊剂管理系统
氮气保护系统
Lead-free reflow soldering oven
Heating system
Cooling system
Flux management
Nitrogen protection system
