ICP-AES测定电镀污泥中的金和钯

Study of Using ICP-AES to Determine Au and Pd in Electroplating Sludge

介绍了含贵金属电镀污泥的样品采集、制备和预处理方法,并对有关问题进行了讨论.研究了电感耦合等离子体-原子发射光谱(ICP-AES)直接测定电镀污泥中微量金、钯的分析方法.结果表明:在选定的最佳仪器工作条件下,金、钯的检出限分别为0.015和0.018 mg/L,加标回收率为94.0%～104.0%,相对标准偏差小于3%.该方法可用于电镀污泥中微量金、钯的测定.

Sampling, sample preparation and sample pretreatment method for electroplating sludge contained noble metals has been prepared, and related topics discussed. The direct determination of micro gold and palladium in the electroplating sludge using ICP-AES was studied. The result shows that under the optimal instrument parameters and working conditions, the detection limits of gold and palladium are 0.015-0.018 mg/L, respectively. The recovery rates are in the range of 94.0%-104.0% . The relative standard deviations （RSDs） are less than 3% . The method can be used to determine Au and Pd in electroplating sludge.