CBGA不同尺寸焊点热循环载荷下应力应变的有限元模拟

FEM analysis of stress and strain in CBGA solder joint with different size under thermal cycle

采用ANSYS分析软件,将组件简化为二维模型的焊点应力应变有限元分析。通过研究三种BGA球(0.76 mm、1.0 mm、1.3 mm)组件,利用有限元模拟CBGA(陶瓷球栅阵列)组件在热循环加载条件下其应力应变分布,并且计算了焊点的应力应变最大值,得出球径为0.76 mm的CBGA组件其可靠性最好,表明有限元方法可有效地用于研究微电子封装中各类焊点的可靠性。

The components of CBGA was simplified into 2-D model of finite element analysis for the stress and strain of soldered joint,and the finite element method was used to simulate the distribution of stress and strain of three kinds of CBGA components(0.76mm,1.0mm and 1.3mm) under thermal cycle,and calculate the maximum of stress and strain.The results show that the reliability of CBGA components with(0.76mm) diameter is the best and the analysis indicates the finite element simulation is suitable for studying reliability of all kinds of soldered joints in packaging of microelectronics.