摘要
本文探讨了可以用于生产厂封装的器件的各种热管理方案,并且引用了国际整流器公司的测试数据,来评估使用小型散热器改善这些器件散热性能的优点,并研究了在进行通电循环的情况下,在器件上直接安装散热器对器件可靠性的影响。
In this paper, we look at the thermal management strategies available for source-mounted packages and using empirical data from International Rectifier's own tests, assess the advantages of using small heatsinks to improve heat dissipation in these devices. The impact of direct heatsink attachment on device reliability under power cycling conditions isa lsoi nvestigated.
出处
《电子设计应用》
2005年第10期105-106,13,共2页
Electronic Design & Application World
