挤压铸造法制备高致密Mo/Cu及其导热性能

Highly dense Mo/Cu composites fabricated by squeeze casting and their thermal conduction properties

采用专利挤压铸造方法制备了3种Mo体积分数分别为55%、60%和67%的Mo/Cu复合材料,并对其微观组织和导热性能进行了研究.结果表明:Mo颗粒分布均匀,Mo/Cu界面干净,不存在任何界面反应物和非晶层;复合材料组织均匀、致密,且致密度高达99%以上;复合材料的热导率为220～270 W/(m·K),并随着Mo含量的增加而降低.混合定律(ROM)较好地预测了55%Mo/Cu复合材料的热导率,而采用Maxwell模型和H-M模型的计算值与60%和67%Mo/Cu复合材料的热导率测试值一致.

Mo/Cu composites with Mo volume fractions of 55%, 60% and 67% were fabricated by the patented squeeze-casting technology, and the microstructures and thermal conduction properties of the Mo/Cu composites were investigated, The results show that Mo particles are homogeneous and uniform, and the Mo/Cu interfaces are clean and free from interfacial reaction products or amorphous layers. The relative density of the Mo/Cu composites is higher than 99%. The thermal conductivity of Mo/Cu composites is 220 - 270 W/（m · K）, which can meet the demands of high thermal conductivity for electronic package. The thermal conductivities of Mo/Cu composites decrease with the increase of Mo volume fraction. The ROM model can well predicate the thermal conductivities of 55% Mo/Cu composites, while the values calculated by Maxwell model and H-M Model agree well with the thermal conductivities of 60% and 67%Mo/Cu composites.