无铅钎焊——机遇和挑战

Lead Free—A Great Chance and Challenge

环境法规和利益相关方对环境意识的增强要求电子设备中不应含有铅。许多电子制造商将在2006年前从传统的锡铅合金钎焊工艺改变为无铅合金的钎焊工艺。虽然试验证明从技术上可以有多种锡铅的替代物,但在高技术制造上实施新工艺仍然存在一系列的挑战。中国目前尚处于替代技术规划期,因此,许多生产者持旁观态度,而一些装配商感到了来自替代要求的威胁。本文在总结全球相关的法规后,对无铅钎焊工艺进行了评述,并提出了如何应对挑战的建议。

Environmental regulations and stronger environmental awareness from stakeholders are forcing the elimination of lead from electronic equipment. Many electronics manufacturers will transition their soldering processes from traditional tin-lead alloys to lead-free alloys before 2006. Although many alternatives to tin-lead have been proven to be technically viable in test scale, the implementation of the new processes in high-tech manufacturing still presents a series of challenges to electrical and electronic industry. Many producers, particularly in China, are still formulating their transition plan or stay at the sidelines. Some assemblers even feel threatened by the upcoming requirements. This paper reviews the major considerations for lead-free soldering processes after summarizing the relevant global legislations. Recommendations for Chinese companies are suggested on how to cope with the challenges.