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Capillary wave formation on excited solder jet and fabrication of lead-free solder ball 被引量:3

Capillary wave formation on excited solder jet and fabrication of lead-free solder ball
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摘要 A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ=C_ vib(σ/ρ) 1/3f -2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball. A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ = Cvib (σ/ρ)^1/3 f^-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.
出处 《中国有色金属学会会刊:英文版》 EI CSCD 2005年第5期997-1002,共6页 Transactions of Nonferrous Metals Society of China
基金 Project(2002AA322040)supportedbytheNationalHigh-TechResearchandDevelopmentProgramofChina
关键词 金属加工 焊接材料 焊接工艺 毛细作用 jet breakup capillary wave disturbance solder ball
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