摘要
随着SMT 封装技术的发展,表面安装型塑封体由于吸湿性引起的开裂问题越来越突出。本文主要对表面安装型塑封体(如SOP、PLCC、PQFP、PBGA 等)在回流焊时吸湿开裂机理以及相应对策等进行讨论分析。
With the advent of “surface mount technology” （ SMT ）, the problem of plastic package moisture-induced cracking arises. This paper is mostly studying and analyzing moisture-induced cracking of surface mount packages （ SOP PLCC, PQFP, PBGA etc. ） under specified reflow soldering conditions and put forward some corresponding countermeasures.
出处
《电子与封装》
2005年第10期14-16,5,共4页
Electronics & Packaging
关键词
塑封体
SMT
吸湿
开裂
对策
Plastic Package
SMT, Moisture
Cracking
Countermeasure
