低k层间介质研究进展

Development of Low-k Materials as Inter-Level Dielectrics

介绍了低k介质材料的研究和发展状况,从制备方法和材料特性等不同角度对低k材料进行分类,并结合ULSI对低k材料的要求讨论了低k材料在ULSI中的应用前景。

Current study and development of low-k dielectric constant materials are introduced. Low-k dielectric constant materials are classified from different aspects, such as preparation method and material properties. The prospect on the application of low-k dielectric constant materials in ULSI technology is also discussed to meet the stringent requirements of the fabrication processes.