镍磷化学镀镀层沉积速率影响因素研究

Study on the factors of influencing the depositional rate of chemical nickel-phosphorus plating

本文着重讨论了影响镍磷化学镀镀层沉积速率的主要因素,研究了镀液中硫酸镍浓度、次亚磷酸钠浓度、pH值、络合剂浓度及络合剂种类与化学镀镀层沉积速率的关系.实验结果表明:镍磷化学镀镀层沉积速率除随着硫酸镍浓度、次亚磷酸钠浓度、pH值、络合剂浓度的增大而加快外,还与络合剂种类有密切的关系,但当这些因素取上限值时,沉积速率不再上升,反而会出现下降的趋势.由此可得出优选的镀液配方为:硫酸镍、次亚磷酸钠浓度均为28～35 g/L,pH值5.5～6.0,并添加复合络合剂,通过溶液中镍离子的浓度确定络合剂的最佳用量.

The relationships are studied by experiments between the depositional rate of nickel-phosphorus plating and the concentrations of nickel sulfate and sodium hypophosphite, the pH value, the category and dose of complexing agent of plating liquid. The experimental results show that, the depositional rate increases with the increase of the concentrations of nickel sulfate, sodium hypophosphite and complexing agent and the pH value, and it is also concerned with the category of comlexing agent. The optimal formation of plating liquid is: the concentrations of nickel sulfate and sodium hypophosphite are all 28～35 g/L, the pH value is 5.5～6.0, compound complexing agent should be used, and the dose of complexing agent is determined according to the concentration of nickel ion in plating liquid.