双脉冲DMS氰化光亮镀银工艺技术的应用

Application of double-pulse DMS cyanide bright silver plating technology

介绍了双脉冲氰化光亮镀银的工艺流程和工艺配方。讨论了脉冲电源参数、镀液中的硝酸银、氰化钾和 DMS光亮剂的质量浓度以及镀液温度对镀层质量的影响。对镀层缺陷产生的原因进行了分析。实践证明,与直流电镀相 比,在20～30℃的镀液中,采用双脉冲DMS氰化光亮镀银工艺,可以获得外观光亮的银镀层,且其抗变色性能增强,同 时生产效率提高30％,每年可以节约银20％、铜刷72只、工时1240 h。

The process flow and bath formula of double-pulse DMS cyanide bright silver plating were introduced . The influences of the parameters of pulse power, the concentration of silver nitrate,potassium cyanide,DMS brightener in the bath and temperature on deposit quality were discussed. The reasons of deposit defects were analyzed. The practice shows that bright silver deposits with improved anti-tarnish performance can be obtained by the double-pulse DMS cyanide bright silver plating process at 20 - 30 ℃ rather than direct current plating. By using this process the production efficiency is increased by 30% , and 20% of silver, 72 copper brushes and 1240 hours of working time can be saved each year.