摘要
近年来磁控溅射技术的应用日趋广泛,在工业生产和科学研究领域发挥巨大作用。随着对具有各种新型功能的薄膜需求的增加,相应的磁控溅射技术也获得进一步的发展。本文将介绍磁控溅射技术的发展,以及闭合磁场非平衡溅射、高速率溅射及自溅射、中频及脉冲溅射等各种新技术及特点,阐述磁控溅射技术在电子、光学、表面功能薄膜、薄膜发光材料等许多方面的应用。
Magnetron sputtering is a widely used method for thin film deposition in recent years, which makes a great impact on the industrial production and scientific research. Magnetron technology is continuously developing because new advanced films with specific functional properties are needed. The paper will describe the development of magnetron technology and novel technologies such as closed-field unbalanced magnetron sputtering, High-rate magnetmn sputtering, sustained self-sputtering, AC or medium frequency sputtering and pulsed sputtering. The application of magnetron sputtering in electronics, optics, surface engineering and electroluminescent component will be shown.
出处
《现代仪器》
2005年第5期1-5,共5页
Modern Instruments
基金
硅基发光研究项目得到国家自然科学基金委员会光电重大计划重点项目90201037资助
关键词
薄膜
沉积方法
磁控溅射技术
闭合磁场非平衡溅射
高速率溅射
自溅射
脉冲溅射
Magnetron Sputtering yield Unbalanced magnetron sputtering Closed-field Unbalanced magnetron sputtering Sustained self-sputtering
