电子封装用环氧树脂的研究进展

Progress in epoxy resin for electronic packaging

介绍了国内环氧树脂的生产现状及其在电子封装业中的发展前景,并概述了现代电子封装对环氧树脂性能的新要求及电子封装无铅化对环氧树脂提出的挑战。

This artiele introduced the production status of epoxy resin in domestic and its development respect in electronic packaging.With the development of electronic packaging technology and lead-free in electronic packaging,the demand and challenge of epoxy resin were also discussed.