表面封装技术组件焊点热变形的云纹干涉法研究

Thermal deformation measurement of solder joints in surface mounted technique components using Moire interferometry

表面封装技术组件的焊点作为唯一联接芯片载体与电路板基板之间的机械物，它在温度循环下的可靠性问题是人们普遍关注的焦点。本文通过在组件的不同部位复制１２００线／ｍｍ高频正交全息光栅，采用高灵敏度云纹干涉法测得了翼型引脚首尾两端的面内剪切位移，为阐述表面封装组件的疲劳损伤机理提供了可靠的实验数据。

In surface mounted structures, solder joints are the only mechanical means that connectthe chip carrier and the printed circuit board. Their reliability during temperature cycling is the keyproblem in this paper, the in-plane shear displacements of the starting and ending points of the gullwing leads were obtained using the high sensitivity Moire interferometry by replicating 1200l/mm.crossed-line diffraction gratings on the specimen. The experimental results offered reliable data to explain the thermal fatigue mechanism of surface-mounted components.