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利用SEM-EBSP研究多晶体材料高温蠕变损伤组织的不均匀性 被引量:2

Study on Unhomogeneity of Creep Damaged Microstructure for Polystalline by SEM-EBSP
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摘要 研究了多晶体材料在高温蠕变下的空洞出现位置和损伤特点,认为同一组织下空洞的出现及蠕变损伤的位置与晶粒尺寸有关系,晶粒尺寸小的部位易发生损伤。使用电子背散射衍射技术研究了不同损伤位置附近的亚结构形成情况,结合亚结构、晶界滑移、晶粒尺寸与材料变形协调性等材料变形特点,对蠕变损伤机理进行了探讨。 The creep cavity location and damage of polycrystalline material was studied, and it was considered that there was a great correlation between the cavity sites, creep damage and grain size, and the damage often occurred in the location where grain size was small. The substructure near the damage position was studied by EBSP, then vonbined with the relationship among substructure grain boundary sliding,grain size and material deformation compatibility the mechanics of creep damage was discussed.
出处 《物理测试》 CAS 2005年第5期4-7,共4页 Physics Examination and Testing
关键词 EBSP 晶界类型 亚晶粒 晶粒尺寸 蠕变空洞 取向差 EBSP, grain boundary character, grain size creep cavity misorientation
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