利用金属间化合物增强陶瓷钎焊接头强度

Strength of Ceramic Joints Bonded with Reinforcements of Intermetallic Compounds

研究了Ag-Cu-Ti/加Ti/N i/Ti复合层钎焊S i3N4陶瓷的接头组织与性能。结果表明,钎缝中形成了以金属间化合物为高熔点相和Ag-Cu作为基体的组织。对界面反应层的观察表明,反应层分为两层结构。保温时间、连接温度、Ti箔和N i箔厚度及Ag-Cu-Ti钎料厚度均能影响接头组织和强度。在本实验范围内,其它参数一定的条件下,分别在30m in,970℃,Ti箔30μm和N i箔60μm及Ag-Cu-Ti片150μm时取得了最大强度值。

The microstructures and properties of Si3N4 joints bonded with Ag-Cu-Ti foils and Ti/Ni/Ti multi-interlayer were investigated. The results showed that intermetallic compounds formed as high melting point phase in Ag-Cu matrix. The observation of interfacial reaction layer showed that it is a two-layer structure, The microstructures and joint strengths can be affected by the parameters such as holding time. bonding teraperature, thickness of Ti, Ni , and Ag-Cu-Ti. In these experiments, when other parameters were constant, the maximal joint strengths obtained at 30min. 970℃ ,in 30μm of Ti,60μm of Ni and 150μm of Ag-Cu-Ti respectively.