摘要
介绍了一种比较新颖的、技术要求比较高的,能广泛应用于HDI技术领域的超薄铜箔,并且通过其在图形电镀中的应用及激光钻孔后的电镀效果研究,可以充分体会到这种铜箔优异的性能。
This paper introduces a novel ultra-thin copper foil, which contains high technology and can be used to HDI/BUM field. Through the study to this copper foil when it was used in the pattern plating and in the plating of laser microvia, we can find the excellent proprieties of it.
出处
《印制电路信息》
2005年第3期29-34,共6页
Printed Circuit Information
