摘要
概述了化学镀Cu用的前处理工艺-Alkatpe工艺,适用于制造高密度PCB。
This paper describes the before treatment process for electroless copper plating-Alkatpe process. It is suitable for manufacturing high density printed wiring board.
出处
《印制电路信息》
2005年第3期41-44,共4页
Printed Circuit Information
