三维(3D)互连校准型晶圆片压焊技术

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摘要本文对有发展前途的三维(3D)技术平台进行简要回顾,说明采用校准型晶圆片压焊技术的晶圆片级三维(3D)集成。重点强调了胶粘剂晶圆片压焊技术,分别叙述了3D集成、校准型晶圆片压焊、多芯片互连、晶圆片校准和晶圆片级3D ICs的关键性问题,并对所获得的结果进行综述。

作者杨建生

机构地区天水华天科技股份有限公司

出处《集成电路应用》 2005年第10期42-45,共4页 Application of IC

关键词晶圆片压焊技术三维集成校准互连技术技术平台芯片互连圆片级压焊三维胶粘剂

参考文献7

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3J.Q. Lu, "Wafer-Level 3-D Hyper-Integration Processing Technology," 3-D Technology, Modeling and Process Symp., April 2004.
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7电子封装技术丛书编委会编.《微电子封装技术手册》，中国科学技术大学出版社，2003年，合肥,P290～297.

集成电路应用

2005年第10期

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