电镀镍金焊接强度不足的原因及对策

Causes and Countermeasures of Deficiency of Soldering in Tension of Electrolyte Nickel/Gold

简述了电镀镍/金焊接过程中拉脱强度不足现象,分析了导致拉脱强度不足的电镀过程中和焊接过程中可能存在的影响因素。

This paper describes the phenomena of the deficiency of soldering intension of electrolyte nickel/gold, and analyzes the factors which affect the solderability.