摘要
介绍了铅的危害与焊接中的问题,希望能给一些同业者带来帮助。
The article introduce the lead which is harm for man and the question in soldering. I hope that it can help some business.
出处
《印制电路信息》
2005年第7期58-64,共7页
Printed Circuit Information
关键词
铅
焊点空洞
焊环浮裂
引脚锡须
界面微洞
板材热裂
湿气敏感
无铅
lead soldorpoint voids pad lifting lead foot whisker micro-voiding base material TD moisture sensitive level
