从第十届世界电子电路大会管窥PCB基板的研究进展(1)

The Progress of Research in PCB Substrate From Proceedings of ECWC10

介绍了世界电子电路大会发展的历史,首先围绕ECWC10论文集的范围,剖析了日本两大PCB基板研发的技术特点,两公司的研发产品具有主要性能优越,综合性能平衡的特点,适应当前高频化和无铅化的发展要求。同时,也介绍了纳米技术在基板中的综合运用,最后,分析了导热性基板的研究进展。希望通过对以上有代表性的基板的剖析了解世界基板的发展趋势。

In the paper, the history of ECWC 10 was reviewed. Characteristic of technology in PCB substrate about Hitachi Chemical and Matsushita Electric Works was analyzed from proceedings of the ECWC 10 conference firstly. The product will be adapted to require of high-frequency and lead-free for novel property. At the same, the application of nano-technology used in PCB substrate was introduced. The characteristic of thermal conductor substrate was reviewed in the last. The development of technology shall be realized from the representative outcome of PCB substrate fromECWC 10.