期刊文献+

埋入式电容、电阻技术之探讨 被引量:6

Understanding Tg , Td and Operating Temperature for PCB
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摘要 就各种埋入式电容和电阻材料特性以及相应制程分别做出比较,并指出设计工具以及测试方法等需要继续改进,但埋入无源元件的应用前景将更加广泛。 The author compared the different characteristic of several embedded resistors and capacitors products. The corresponding process were introduced at the same time. And much needs to be done to develop design and test for embedded passives. But they are ready for wide use.
出处 《印制电路信息》 2005年第8期45-47,53,共4页 Printed Circuit Information
关键词 埋入式 电阻 电容 材料 CAD 电阻技术 材料特性 测试方法 设计工具 无源元件 embedded resistor capacitor material CAD
  • 相关文献

参考文献1

  • 1Rolf Funer.Embedded Resistors and Capacitors. Printed circuit design, 2002.12.

同被引文献35

  • 1蔡积庆.从基板到功能板——埋入元件基板的趋向[J].印制电路信息,2004(3):17-22. 被引量:3
  • 2张霞,唐道福.浅谈埋电容PCB的制作工艺[J].印制电路信息,2009,0(S1):471-477. 被引量:1
  • 3陈岩,曾曙.埋入式电容印制电路板制作工艺[J].印制电路信息,2003,11(2):50-54. 被引量:6
  • 4李春甫.网印内埋电阻——网印与电子技术[J].网印工业,2007(4):10-14. 被引量:4
  • 5杨维生.埋电阻台阶式多层微波印制板制造技术研究[J].电子工艺技术,2007,28(2):84-86. 被引量:2
  • 6Lee H F, Chan C Y, Tang C S. Embedding capacitors and resistors into printed circuit boards using a sequential lamination technique [J]. Journal of materials processing technology, 2008, 207:72 - 88.
  • 7Seung Hwan Ko, Jaewon Chung, Heng Pan, et al. Fabrication of multilayer passive and active electric components on polymerusing inkjet printing and low temperature laser processing [J]. Sensors andActuators. 2007(A134): 161-168.
  • 8Han Seo Cho, Sukhyeon Cho, Jihong Jo, et al. Highly reliable processes for embedding discrete passive components into organic substrates [J]. Microelectronics Reliability, 2008(48): 739 - 743.
  • 9Li Chun-Hao, Tsai Ming-Jong. 3D laser trimming technology for regulating embedded thick-film carbon resistors on a random access memory module [J]. Journal of materials processing technology, 2009(209): 2057-2067.
  • 10Li Huiling, Zeng Xiaoyan. A Study on surface property of thick- film embedded resistor fabricated by laser micro-cladding and rapid prototype [J]. Materials Science and Engineering 2008 (A473): 126- 132.

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