对于无铅化的理解和PCB相关考虑

Comprehension of Lead-free and Correlative Consideration for PCB

从无铅化的定义、测定及相关典型无铅焊料的特性和焊接的要求,阐述其对PCB板的影响和克服方法,并提出要求用系统的观点来实现整机产品的可靠性---PCB板的基材材料、无铅焊料等材料选型,加工过程以及评价方法。

This article deals with influence of lead-free to PCB and some ways to overcome, by explaining the definition and measurement of lead-free, as well as the characteristic and assembling requirement of typical lead-free solders. Then, a viewpoint is put forward that the reliability of the end products shall be assured by a systematic idea, including selection of PCB＇s raw materials such as laminate and lead-free solder, as well as its process and evaluation method.