摘要
在发光二极管(LED)的设计中,因为单管LED无法达到照明强度的要求,设计者经常使用多个LED来达到效果。因为散热的原因,LED之间的最佳距离是设计者必须面临的问题。本文认为LED的发热不仅与LED间的距离有关,而且还与它们使用的金属芯印制板(MCPCB)的绝缘层、铜箔层以及焊接层的厚度有关,并导出了它们之间的关系。
As LEDS are used and planned for more general lighting systems, more emphasis is placed on locating these high power package systems in close proximity to each other to produce high lighting levels. This leads to the question of how close can the LEDS be placed by the circuit hoard designer. The spacing issue is affected by the type of printed circuit board （PCB） used, which is normally a metal core PCB （MCPCB）. The variables of dielectric, copper and solder layer thicknesses result in different proximities possible for LED spacing, and are especially critical for COB applications.
出处
《印制电路信息》
2005年第9期45-46,共2页
Printed Circuit Information
