HDI板RCC料层孔壁爆裂原因分析和改善

The Root Cause Analysis and Improvement Action on Hole Wall Crack Defect at RCC Position for HDI PCB

分析了HDI板生产中RCC料层出现孔壁爆裂的原因,同时给出了改善方法,并对此原因和改善方法进行了验证。

The paper show that one root cause of hole wall crack defect on HDI PCB, and verify this result by a series of experiment. And also the detail improvement actions are provided respectively for this defect.