摘要
备受全球关注的WEEE/RoHS法案将于2006年7月1日正式生效,文章从原材料、制程管控及SMT后封装三个方面,多视角的分析下一代PCB环保产品,如何去满足日趋严格的环保技术要求。
Many people paid attention to the world the WEEE/RollS the bill will formally produce effect on July 1 in 2006, and this text is from the original material, manufacturing process to seal to pack three aspects after take care for the control and SMT, much analysis the next generation PCB that see the cape product, how to face gradually and strictly of environmental protection technique request.
出处
《印制电路信息》
2005年第6期13-16,共4页
Printed Circuit Information
