摘要
主要介绍了塞孔技术的概念、塞孔方式、塞孔材料以及相关的研磨设备。
In this paper, the concept of via-filling, methods of via-filling, and material which are used to via-filling are introduced. And the sanding equipments are also introduced.
出处
《印制电路信息》
2005年第6期41-43,72,共4页
Printed Circuit Information
