摘要
叙述了无铅印制板的必备条件及当前状况,并对印制板的无铅焊接特点作了简要分析及相应对策。
Have narrated current condition and the esssential condition of lead free PCB, and have made brief analysis and corresponding countermeasure to characteristic of PCB.
出处
《印制电路信息》
2005年第11期14-18,共5页
Printed Circuit Information
