摘要
随着微电子器件的发展，集成度越来越高，不断向高频、高功率应用迈进，对其封装技术的发展也提出了更高要求。本文以一个场效应管封装外壳的微波设计为例，探讨了微波三维结构仿真技术在封装外壳设计上的应用，证明对封装外壳进行合理的微波设计，可以有效地提高器件的微波性能。
With the development of the micro-electronic device in integration, high frequency and high power packaging technology becomes more and more important. This article discusses the microwave simulation application （ HFSS ） in packaging design with a example of FTE packaging and proves that a reasonable package structure can effectively improve the microwave performance of device.
出处
《电子与封装》
2005年第11期13-16,共4页
Electronics & Packaging
