环氧类电子封装材料的表征及性能研究

Analysis and Evaluation on Epoxy Resins for Encapsulated Material

热固性环氧树脂碱解后易溶于有机溶剂,将得到的水解产物进行红外光谱分析,并与环氧固化物的红外光谱图进行对照,结合热失重分析曲线对封装材料的结构作分析鉴定为酸酐固化的脂环族环氧树脂,其中添加了大量的石英粉。根据热失重曲线求出样品的积分程序分解温度,对封装材料的热稳定性进行了评价。

The Cross-linked epoxy resins cured with acid anhydride were hydrolyzed in methyl benezene-alcoholic, sodium hydroxide solution. The hydrolysate were identified by infrared spectroscopy. This is alicyclic epoxides with hydroxy, carbonyl and no benzene functional group, the hydroxy comes from hydrolyze procedure. The main component and the decomposition process in high temperature of cured epoxy resin were also analyzed by means of IR and thermogravimritry. Thermogram has exhibited thermal stability. The results indicated the decomposition temperature at 1% weight loss is high （ 645K in N2 ）.The integral procedural decomposition temperature （ IPDT ） was also calculated in order to evaluated the thermostability of this encapsulation material, the result is TA =640K.