电子钎料润湿性测量表征方法研究

A Study of Characterization Methods for Wettability of Electronic Solders

分别用3种润湿性测量方法(铺展面积测量法、润湿力测量法和润湿角测量法)做了不同松香浓度和不同助焊剂下的钎料Sn-37Pb的润湿性,以及在不同助焊剂下润湿性.通过对比分析发现,钎料Sn-37Pb的铺展面积和润湿力测量结果随着松香浓度的增加呈现出相近的趋势,有较好的一致性;在不同助焊剂的情况下,不同钎料的铺展面积和润湿力的测量结果较复杂,缺乏一致性.

In this paper, three types of wettability evaluation methods, namely wetted spreading area test, wetting force test and contact angle test, have been used to measure the wettability of Sn - 37Pb using different fluxes which include different concentration of the rosin. After analysis, the result of the wetted spreading area test and the wetted force using different fluxes of different concentration of the rosin has the same trend. The two tests have good consistency. In addition, the two tests are lack of consistency with diverse fluxes.