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Ni-C复合镀层在高分子PTC热敏电阻器上的应用

Application of Ni-C composite deposit to high polymer PTC thermal resistor
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摘要 给出了N i-C复合镀层生产工艺流程及工艺规范。介绍了提高铜箔粗化度及加强碳黑分散的工艺措施。讨论了电流密度、pH、温度及搅拌等操作对镀层及N i-C共沉积的影响。总结了镀液维护及注意事项。实验结果表明,该N i-C复合镀层制作的电极片质量全部达到PTC热敏电阻器性能要求。 The process flow and technical regime of Ni-C composite plating were given. The technical measures to improve roughness copper foil and strengthen dispersion of carbon black were introduced. The influences of current density, pH, temperature and stirring on deposit and Ni-C codeposition were discussed. The maintenance and precautions of bath were summarized. The test results prove that the quality of electrode piece covered by Ni-C composite deposit can satisfy the performance requirements of PTC thermal resister.
作者 金英豪
出处 《电镀与涂饰》 CAS CSCD 2005年第11期26-28,共3页 Electroplating & Finishing
关键词 Ni—C复合镀层 PTC热敏电阻器 铜箔 碳黑 Ni-C composite deposit PTC thermal resister copper foil carbon black
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参考文献1

  • 1欧阳鑫.《电镀工工艺学》中级本(第1版)[M].上海:科学普及出版社,1984.99-100.

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