摘要
随着关、日和欧盟就含铅钎料建立相应立法之后,各国都在紧锣密鼓地开展绿色环保无铅产品的研发工作。介绍了国内外无铅焊料所涉及的4种主要成分设计方法,以及当前研究的主要无铅体系及其各自特征;论述了各焊料体系所应用的范围、组织结构和性能,及无铅焊料所关注的主要性能指标和发展趋势,并结合我国国情展望了我国无铅焊料的前进方向。
With the establishment of green lead-free solder legislation, which declared by US, Japan and EU, more and more countries and companies are engaging in R＆D of lead-free solder. This paper reviews the development of lead-free solder, and analyses several main lead-free solder＇s properties and application field. It also reviews some common reliability problem, developing requirement and tendency of lead-free solder alloy. Further more, the lead-free solder development in China is proposed according to the abundant tin resource of China.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2005年第11期47-49,64,共4页
Materials Reports
基金
国家863计划项目(2002AA322040)
关键词
无铅焊料
电子封装性能
lead-free solder, electronic packaging, property
