摘要
利用红外测温技术,结合导热反问题求解,给出了一种根据圆筒外壁温度计算筒壁厚的方法。经数值实验验证,本方法可对薄壁高温圆筒状热设备的内壁减薄给出高精度的定量检测结果。
By solving an inverse heat conduction problem, one method is given about to compute wall thickness of cylinder-shaped equiPment based on the outer surface tempereture. The conclusion can be drawn that this method can detect inner wall diameter or wall thickness of cylinder-shaped equipment.
出处
《红外技术》
CSCD
北大核心
2005年第6期490-492,共3页
Infrared Technology
基金
河北保定华北电力大学青年教师基金(93210028)
关键词
红外测温
导热反问题
壁厚
infrared
tempereture-measuring
inverse heat conduction problem
wall thickness
