摘要
Fabrication of a strong cube texture Ni substrate through thermomechanical process is reported by ORNL research group. Decreasing the substrate thickness, the engineering critical current density will be improved. Rolled substrates are electropolished to the final thichness of 100, 80, 50, 40, and 20 μm, respectively. Electropolished substrates are recrystallized at temperatures between 800-1000℃ and in a mixed atmosphere of 4% H2 in 99.99% purity Ar. Orientation mappings of recrystallizated tapes are conducted through an EBSD system mounted on a LEO-1450 SEM. The influence of the substrate thickness on texture of the tape is studied in this paper. Results show that with the decrease of substrate thickness, the texture of the tapes with the same recrystallization process is more and more closed to the exact position of cube orientation.
Fabrication of a strong cube texture Ni substrate through thermomechanical process is reported by ORNI. research group. Decreasing the substrate thickness, the engineering critical current density will be improved. Rolled substrates are electropolished to the final thichness of 100, 80, 50, 40, and 20μm, respectively. Electropolished substralesare recrystallized at temperatures between 800-1000℃ and inamixed atmosphere of 4% H2 in 99. 99% purity At. Orientation mappings of recrystallizated tapes are conducted through an EBSD system mounted on a LEO-1450 SEM. The influence of the substrate thickness on texture of the tape is studied in this paper. Results show that with the decrease ofsubstrate thickness, the texture of the tapes with the same recrystallization process is more and more closed to the exact position of cube orienlation.
出处
《广东有色金属学报》
2005年第2期205-209,共5页
Journal of Guangdong Non-Ferrous Metals
基金
Project supported by National High Technonogy Research
Development Program(2002AA306211 ,2004AA306130)
关键词
超导体
厚度
表面密度
薄膜
substrate thickness
orientation mapping
coated conductor