摘要
采用电化学线性极化、交流阻抗谱技术研究了不同基片偏压上阴极电弧沉积TiN/Ti镀层在50×10-6g/gCl-溶液中的腐蚀行为,并对镀层腐蚀的机理进行了探讨。结果表明:基片偏压–400V时,镀层耐蚀性能好;镀层表面的针孔是诱发镀层和基材体系发生点蚀、电偶腐蚀的主要缺陷。
TiN/Ti coatings were deposited at various substrates bias voltage by vacuum cathodic arc deposition. The corrosion behavior of the coatings in 50×10^-6 g/g KCI solution have been studied by potentiodynamic polarization, electrochemical impedance spectroscopy （EIS）. The mechanicms of corrosion was discussed. The result indicate that the corrosion resistance of the coatings deposited at -400 V is significantly enhanced. Galvanic or crevice corrosion process of coatings are mainly caused by the coatings pinhole.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2005年第11期1774-1777,共4页
Rare Metal Materials and Engineering
关键词
基片偏压
TiN/Ti镀层
针孔
腐蚀
substrates bias voltage
TiN/Ti coatings
surface work function
pinhole
corrosion
