摘要
采用气压成形方法对多层板结构件进行了超塑成形/扩散连接(SPF/DB)技术研究。研究表明,最佳的扩散连接工艺参数为:连接温度T=930℃,连接时间t=30m in,连接压力P=10MPa。对连接试件的微观组织进行了观察,显示在界面处形成良好的连接。最佳的成形参数为:成形温度Tf=930℃,成形压力Pf=0.6MPa,成形时间tf=55m in。最后对成形后的板厚分布进行了研究。
The superplastic forming and diffusion bonding(SPF/DB) with gas pressure control for multilayer sheets structure was investigated. The optimum parameters were: bonging temperature T = 930℃ , bonding time t = 30min, bonding pressure P = 10MPa. Microstructure study was carried out with the bonded samples. The microstructure showed an excellent bonding at the interfaces. The optimum parameters for the SPF process were: forming temperature Tf =930℃ , forming pressure Pf =0.6MPa, forming time tf = 55min. The distribution of thickness after SPF was investigated.
出处
《航空材料学报》
EI
CAS
CSCD
2005年第6期29-32,51,共5页
Journal of Aeronautical Materials