期刊文献+

基于步进式电子变阻器的直流电机调速技术

Direct-current motor adjustable-speed technology based on stepping electronic rheostat
下载PDF
导出
摘要 介绍了多级电子分档调速技术。采用步进式电子变阻器和晶闸管研制成的新型直流电机调速电路能使速度逐级平缓地变化。电路设计闭环控制形式,能自动用多种条件完成对直流电动机的控制,并减少功耗。该技术已用在电瓶叉车上,能保证其起步平稳,有效地防止因速度跳变而对机械传动装置所产生的极大冲击力。失控保护电路,既保证安全运行,又能实现联锁及安全自保。该电路在电机控制技术中有较广阔的发展空间。 Muhievel electronic-gears adjustable-speed technology has been introduced. It adopted stepping electronic rheostat and thyristors, and had developed new direct-current motor (DCM) adjustable-speed circuit. Speed change was progressive, step by step, without skipping. The circuit was closed-loop control form. It could complete the control means to the DCM in many ways automatically. Power dissipation was smaller. Battery forklift had applied its technology, the forklift might start smoothly, and active prevented to impact machine delving set by skipping speed, and had designed runaway protecting circuit by logical circuit for safe move. Realizing interlock and self-protect function. The circuit could avoid switching charged contact at contactor also. Which leads to favorable economic benefits and production results. It has a wide developing space in motor controlling technology.
出处 《电机与控制应用》 北大核心 2005年第8期41-43,54,共4页 Electric machines & control application
关键词 电子变阻器 直流电机 平稳调速 失控保护 electronic rheostat DC motor smooth adjustable-speed runaway protecting
  • 相关文献

参考文献7

二级参考文献23

  • 1于庆广,官荷林,李建勋.智能无触点开关及双回路电源自动投切装置[J].电工技术杂志,2004,26(5):72-73. 被引量:16
  • 2谭辉彪,黄靖诚,何勋杰.几种新型无触点开关[J].邵阳高专学报,1996,9(2):160-161. 被引量:1
  • 3.GJB152A—97.军用设备和分系统电磁发射和敏感度测量[S].,1997-5-23..
  • 4凯瑟.电磁兼容原理[M].北京:电子工业出版社,1985..
  • 5沙菲.机电一体化系统的电磁兼容技术[M].北京:中国电力出版社,1998..
  • 6三菱公司.三菱电机功率和智能功率模块应用手册[Z].日本:三菱公司,1996..
  • 7[1]Van Wyk J D, Lee F C.Power Electronics Technology at the Dawn of the New Millennium-status and Future[A].Power Electronics Specialists Conference, 30th Annual IEEE[C].1999:3~12.
  • 8[2]Wu W C, Held M.Investigation on the Long Term Reliability of Power IGBT Modules[A].Proceedings of the 7th International Symposium on Power Semiconductor Devices and ICs[C].1995:443~448.
  • 9[3]Lu G Q,Nelson D J.An Innovative Technique for Packaging Power Electronics Building Blocks Using Metal Posts Interconnected Parallel Plate Structures[J].IEEE Trans. on Advanced Packaging,1999,22(2):136~144.
  • 10[4]Liu X S,Calata J N.The Packaging of Integrated Power Electronics Modules using Flip-chip Technology[A].Applied Power Electronics Conference and Exposition,2000 Fifteenth Annual IEEE[C].2000: 290~296.

共引文献27

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部