ZVD型片式塑封ZnO压敏电阻器的制备

Chip Molded ZnO Varistors(SMD) Type ZVD

用圆片压敏电阻器的单层被银瓷片,制成片式ZnO压敏电阻器,从而解决了制造尺寸较小、电压较高、电流较大的片式压敏电阻器这一难题。将ZnO陶瓷芯片夹于上下两连体扁平引线中间焊接后,再模塑环氧树脂封装,然后分割切开连体引线,使切开后的扁平引线贴在外壳表面,得到了片式塑封ZnO压敏电阻器。该产品与片式单层矩形和多层矩形ZnO压敏电阻器相比,具有更高的可靠性和性价比。

It was relatively difficult to manufacture small chip varistors which had high voltage and current. Chip ZnO varistors were made from single layer ceramic disc with silver electrode. First, the disc ZnO ceramic elements were placed between the terminals of two tapes of joint-body lead, and they were soldered, then the ceramic discs and the terminals with epoxy resin were molded. Secondly the terminals of the joint-body lead were cut separately, the cut terminals were attached on the surface of molded body, so chip molded ZnO varistors were made.. These products have better reliability and performance/price than rectangle shape single layer varistors or rectangle shape multi-layer ZnO varistors.