摘要
SMT再流焊温度场是非常复杂的,因而在设定再流焊工艺时,通常采用反复试验的方法,不仅耗费巨大的人力、物力,并且很难建立一个好的工艺。利用传热学的知识结合再流焊通用的红外加热风再流焊焊接设备,建立再流焊温度场的数学模型,从而为再流焊的仿真打下基础。
The temperature field of SMT is very complicated. When we design the process of SMT, we usually accord to our Experience. This method is not only costing great money and human, but also difficultly setting up a good process. Using the knowledge of transmit heat and the equipment of infrared with hot wind, we set up the mathematics modeling of temperature field of SMT. This is base for the establishing simulation of SMT.
出处
《电子工艺技术》
2005年第6期333-335,共3页
Electronics Process Technology
